The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Mar. 15, 2021
Applicant:
Transcend Information, Inc., Taipei, TW;
Inventors:
Bing-Lian Lin, New Taipei, TW;
Chao-Wei Ko, Taipei, TW;
Assignee:
Transcend Information, Inc., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/04 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
G11C 5/025 (2013.01); G11C 5/063 (2013.01); H01L 23/14 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/1434 (2013.01);
Abstract
A semiconductor memory package structure includes at least one semiconductor die and a lead group. The at least one semiconductor die includes a chip enable terminal. The lead group is configured to electrically connect the chip enable terminal to an external circuit board and includes a first pin and a second pin coupled to the chip enable terminal. The at least one semiconductor die and the lead group are formed as an integral entity using an insulating material.