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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11507229 B1

PDFFull Text
Date of Patent:
Nov. 22, 2022

Filed:

Nov. 16, 2020

Molded body for electronic function, method for manufacturing the same, and operation device using molded body for electronic function

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroshi Morioka, Osaka, JP;

Takashi Morimoto, Osaka, JP;

Hideaki Eto, Osaka, JP;

Tomoya Moriura, Osaka, JP;

Wahei Agemizu, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Stephen T Reed

Int. Cl.
CPC ...
G06F 3/044 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); B29C 45/16 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); B29C 45/14336 (2013.01); B29C 45/1671 (2013.01); H01L 25/0753 (2013.01); H01L 33/483 (2013.01); H01L 33/60 (2013.01); B29L 2031/3475 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01);
Abstract

A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.

Find Patent Forward Citations

Morioka, Hiroshi. (2022). Molded body for electronic function, method for manufacturing the same, and operation device using molded body for electronic function (U.S. Patent No. 11507229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11507229

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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