The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Dec. 12, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Tomoya Hattori, Tokyo, JP;
Noboru Kawaguchi, Tokyo, JP;
Toshitaka Nakaoji, Tokyo, JP;
Atsumu Oikawa, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A honeycomb sandwich panel having an absolute value of thermal expansion coefficient smaller than an absolute value of thermal expansion coefficient obtained by using carbon fiber reinforced plastic (CFRP) is provided. The honeycomb sandwich panel includes: a first skin being a plate material made of a low expansion metal being a metal having an absolute value of thermal expansion coefficient smaller than an absolute value of thermal expansion coefficient of CFRP; a second skin being a plate material made of the low expansion metal and arranged to face the first skin; and a core made of CFRP or the low expansion metal, being bonded to the first skin and the second skin and including a plurality of tubular cells each having a hexagonal cross section, the tubular cells being formed adjacently to each other.