The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jun. 16, 2021
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Kuang-Yao Chen, Taoyuan, TW;

Kao-Chi Chen, Taoyuan, TW;

Wei-Chan Hsu, Taoyuan, TW;

Gow-Zin Yiu, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01); H05K 3/24 (2006.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4272 (2013.01); G02B 6/428 (2013.01); H04B 10/40 (2013.01); H05K 3/242 (2013.01);
Abstract

The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.


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