The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Mar. 01, 2019
Delphi Technologies Ip Limited, St. Michael, BB;
Gregg N. Francisco, Cicero, IN (US);
Kevin M. Gertiser, Carmel, IN (US);
Jack L. Glenn, Union Pier, MI (US);
Narendra J. Mane, Kokomo, IN (US);
Thomas E. Pritchett, Clarksburg, MD (US);
Soumyajit Routh, Kokomo, IN (US);
Kok Wee Yeo, Singapore, SG;
DELPHI TECHNOLOGIES IP LIMITED, St. Michael, BB;
Abstract
A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.