The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jul. 25, 2018
Applicant:

Kcf Technologies Co., Ltd., Anyang-si, KR;

Inventors:

Shan Hua Jin, Anyang-si, KR;

An Na Lee, Anyang-si, KR;

Seung Min Kim, Anyang-si, KR;

Assignee:

SK NEXILIS CO., LTD., Jeongeup-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/04 (2006.01); C25D 1/04 (2006.01); C25D 3/38 (2006.01); C25D 5/34 (2006.01); C25D 5/48 (2006.01); H01M 4/13 (2010.01); H01M 4/66 (2006.01); H01M 10/052 (2010.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); B32B 15/01 (2013.01); C25D 3/38 (2013.01); C25D 5/34 (2013.01); C25D 5/48 (2013.01); H01M 4/13 (2013.01); H01M 4/66 (2013.01); H01M 10/052 (2013.01); Y10T 428/12431 (2015.01);
Abstract

Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.


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