The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Feb. 27, 2019
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Koji Furukawa, Ehime, JP;
Junko Kawasaki, Ehime, JP;
Soichi Yoshizaki, Ehime, JP;
Kentaro Sano, Ehime, JP;
Toshiya Kamae, Ehime, JP;
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/32 (2006.01); C08J 5/24 (2006.01); C08G 59/40 (2006.01); C08K 5/06 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/3227 (2013.01); C08G 59/4021 (2013.01); C08J 5/243 (2021.05); C08J 5/249 (2021.05); C08K 5/06 (2013.01); C08L 63/00 (2013.01); C08J 2363/00 (2013.01); C08L 2205/02 (2013.01);
Abstract
A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.