The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Nov. 29, 2019
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Holger Hoefer, Juelich, DE;
Klaus Offterdinger, Stuttgart, DE;
Maximilian Amberger, Karlsruhe, DE;
Michael Stumber, Korntal-Muenchingen, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81B 7/0016 (2013.01); B81B 7/02 (2013.01); B81B 7/0038 (2013.01); B81B 2201/0228 (2013.01); B81C 2201/0187 (2013.01); B81C 2203/0118 (2013.01);
Abstract
A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.