The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Dec. 30, 2016
Applicant:

Thales Alenia Space Italia S.p.a. Con Unico Socio, Rome, IT;

Inventor:

Alberto Meschini, Rome, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B64G 1/64 (2006.01); B23K 1/002 (2006.01); B62D 33/06 (2006.01); B62D 21/06 (2006.01); B23K 1/005 (2006.01); B23K 3/047 (2006.01); B64G 1/10 (2006.01);
U.S. Cl.
CPC ...
B64G 1/645 (2013.01); B23K 1/002 (2013.01); B23K 1/005 (2013.01); B23K 3/0475 (2013.01); B62D 21/06 (2013.01); B62D 33/06 (2013.01); B62D 33/0617 (2013.01); B64G 1/10 (2013.01);
Abstract

The present invention relates to a release system (), that includes a segmented structural element () comprising: a first segment () designed to be coupled to a first structure, a second segment () designed to be coupled to a second structure, and a solder joint () joining respective ends of said first () and second () segments, thus holding down the first and second structures with respect to one another; wherein said solder joint () is electromagnetically heatable and includes a solder alloy having a predefined melting temperature. The release system () is characterized by further including magnetic field generating means (, PW, PW, PW, PW, PW) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint () such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first () and second () segments is caused, thus enabling release of the first and second structures from one another.


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