The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

May. 11, 2020
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Christopher D. Prest, San Francisco, CA (US);

Stephen P. Zadesky, Portola Valley, CA (US);

Trent Weber, San Francisco, CA (US);

Lucy E. Browning, San Francisco, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60R 7/04 (2006.01); A45C 11/00 (2006.01); B60R 11/02 (2006.01); G06F 1/18 (2006.01); H01L 23/043 (2006.01); H01L 23/047 (2006.01); H01L 23/053 (2006.01); H01L 23/057 (2006.01); H01L 23/10 (2006.01); H05K 5/00 (2006.01); H05K 13/00 (2006.01); G06F 1/16 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01); H05K 5/06 (2006.01); B60R 11/00 (2006.01);
U.S. Cl.
CPC ...
B60R 7/04 (2013.01); A45C 11/00 (2013.01); B60R 11/0211 (2013.01); B60R 11/0241 (2013.01); B60R 11/0252 (2013.01); G06F 1/1656 (2013.01); G06F 1/181 (2013.01); H01L 23/043 (2013.01); H01L 23/047 (2013.01); H01L 23/053 (2013.01); H01L 23/057 (2013.01); H01L 23/10 (2013.01); H05K 5/0004 (2013.01); H05K 5/0021 (2013.01); H05K 5/02 (2013.01); H05K 5/04 (2013.01); H05K 5/069 (2013.01); H05K 13/00 (2013.01); A45C 2011/001 (2013.01); A45C 2011/002 (2013.01); A45C 2011/003 (2013.01); B60R 2011/0003 (2013.01); B60R 2011/0057 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/302 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/49826 (2015.01);
Abstract

An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.


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