The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Mar. 19, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Sofiane Berlat, San Francisco, CA (US);

Aedhan M. Loomis, Philadelphia, PA (US);

Peter F. Coxeter, Sunnyvale, CA (US);

Sarah J. Montplaisir, Santa Cruz, CA (US);

Timon A. Wright, San Francisco, CA (US);

Yohji Hamada, Wakayama, JP;

Patrick Perry, Cupertino, CA (US);

Chad J. Miller, Los Gatos, CA (US);

Andrew L. Rosenberg, Sunnyvale, CA (US);

Daniel A. Podhajny, San Jose, CA (US);

Daniel D. Sunshine, Sunnyvale, CA (US);

Jessica J. Lu, Mountain View, CA (US);

Lia M. Uesato, San Jose, CA (US);

Donald L. Olmstead, Aptos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/09 (2019.01); D04B 1/08 (2006.01); D04B 21/20 (2006.01); D04B 1/22 (2006.01); D05B 1/06 (2006.01); D05B 93/00 (2006.01); B29C 70/24 (2006.01); B29C 65/00 (2006.01); A45C 11/00 (2006.01); B32B 3/26 (2006.01); B32B 5/06 (2006.01);
U.S. Cl.
CPC ...
B32B 7/09 (2019.01); B29C 66/721 (2013.01); B29C 70/24 (2013.01); B32B 5/06 (2013.01); D04B 1/08 (2013.01); D04B 1/22 (2013.01); D04B 21/20 (2013.01); D05B 1/06 (2013.01); D05B 93/00 (2013.01); A45C 2011/002 (2013.01); B32B 3/266 (2013.01); B32B 2262/02 (2013.01); B32B 2307/202 (2013.01); B32B 2439/02 (2013.01);
Abstract

An item may be formed from structures that include holes. Stitching may be used to form a seam that joins the structures. The stitching may be formed from a chain stitch that passes through the holes. The holes may be formed from loops of knit fabric or other holes. Leather layers, polymer layers, fabric layers, and other structures with holes may be joined using the stitching. During fabrication, a layer of material with holes may be placed on an adjustable-shape fixture having a bed of needles. The shape of the bed of nails in the adjustable-shape fixture may then be changed. After the fixture has been used to transform the shape of one or more of the structures, the structures may be placed on needles in an assembly fixture and the stitching between the structures may be formed. The item may be an electronic device cover or other item.


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