The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Nov. 13, 2017
Applicant:

Siemens Energy Global Gmbh & Co. KG, Munich, DE;

Inventors:

Bernd Burbaum, Falkensee, DE;

Henning Hanebuth, Pliening OT Gelting, DE;

Ahmed Kamel, Orlando, FL (US);

Thomas Lorenz, Erlangen, DE;

Kazim Ozbaysal, Charlotte, NC (US);

Ingo Reinkensmeier, Fröndenberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/10 (2006.01); B23K 35/30 (2006.01); B33Y 10/00 (2015.01); B22F 12/00 (2021.01); B22F 5/04 (2006.01); B23K 1/005 (2006.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B22F 12/00 (2021.01); B22F 3/1017 (2013.01); B22F 5/04 (2013.01); B23K 1/0056 (2013.01); B23K 35/3033 (2013.01); B22F 10/10 (2021.01); B22F 2202/11 (2013.01); B22F 2301/155 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fraction of a base material for the component and a minor fraction of a solder, depositing a second layer of the base material for the component and a thermal treatment of the layer arrangement. The thermal treatment includes a first thermal cycle at a first temperature above 1200° C. for a duration of more than 3 hours, a subsequent second thermal cycle at a second temperature above 1000° C. for more than 2 hours, and a subsequent third thermal cycle and a third temperature above 700° C. for more than 12 hours. A manufactured component is also presented.


Find Patent Forward Citations

Loading…