The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Feb. 16, 2017
Applicants:

Arizona Board of Regents on Behalf of Arizona State University, Scottsdale, AZ (US);

The Penn State Research Foundation, University Park, PA (US);

Inventors:

Owen Hildreth, Tempe, AZ (US);

David Wright, Mesa, AZ (US);

Abdalla Nassar, State College, PA (US);

Tim Simpson, State College, PA (US);

Christopher Lefky, Tempe, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 3/24 (2006.01); C25F 3/00 (2006.01); C25F 3/06 (2006.01); C25F 3/08 (2006.01); B22F 10/62 (2021.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B33Y 70/00 (2020.01); B22F 10/66 (2021.01); B33Y 40/20 (2020.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 3/24 (2013.01); B22F 10/62 (2021.01); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); C25F 3/00 (2013.01); C25F 3/06 (2013.01); C25F 3/08 (2013.01); B22F 10/66 (2021.01); B22F 2999/00 (2013.01); B33Y 10/00 (2014.12);
Abstract

Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.


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