The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Aug. 27, 2020
Applicant:

Delta Electronics,inc., Taiwan, CN;

Inventors:

Haoyi Ye, Taiwan, CN;

Jianhong Zeng, Taiwan, CN;

Yu Zhang, Taiwan, CN;

Peiqing Hu, Taiwan, CN;

Ziying Zhou, Taiwan, CN;

Assignee:

Delta Electronics Inc., Taoyuan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/10 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); G06F 1/20 (2006.01); G06F 1/18 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H05K 3/36 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); G06F 1/188 (2013.01); G06F 1/20 (2013.01); H05K 1/0218 (2013.01); H05K 1/0262 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 7/10 (2013.01); H05K 7/2039 (2013.01); H01L 25/165 (2013.01); H05K 3/368 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10545 (2013.01);
Abstract

The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.


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