The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Jan. 20, 2021
Applicant:
Molex, Llc, Lisle, IL (US);
Inventors:
Assignee:
Molex, LLC, Lisle, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/18 (2006.01); H05K 3/20 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/188 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/0393 (2013.01); H05K 1/092 (2013.01); H05K 1/183 (2013.01); H05K 3/107 (2013.01); H05K 3/182 (2013.01); H05K 3/202 (2013.01); H05K 1/0265 (2013.01); H05K 3/027 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2203/0706 (2013.01); H05K 2203/0709 (2013.01); H05K 2203/0716 (2013.01); H05K 2203/108 (2013.01); H05K 2203/1131 (2013.01);
Abstract
Depicted embodiments are directed to an Application Specific Electronics Packaging ('ASEP') system, which enables the manufacture of additional products using reel to reel () manufacturing processes as opposed to the 'batch' processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.