The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Jul. 12, 2019
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Takuya Taniuchi, Osaka, JP;
Ryohei Kakiuchi, Osaka, JP;
Naoki Shibata, Osaka, JP;
Yasunari Oyabu, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/06 (2013.01); H05K 1/02 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0562 (2013.01); H05K 2203/166 (2013.01);
Abstract
A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.