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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11503704 B1

PDFFull Text
Date of Patent:
Nov. 15, 2022

Filed:

Dec. 30, 2019

Systems and methods for hybrid glass and organic packaging for radio frequency electronics

Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Christopher James Kapusta, Delanson, NY (US);

Stanton Earl Weaver, Jr., Broadalbin, NY (US);

Joseph Alfred Iannotti, Glenville, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:

Armstrong Teasdale LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/13 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/58 (2006.01); H01L 23/66 (2006.01); H01L 23/485 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 3/462 (2013.01); H05K 3/4605 (2013.01); H05K 3/4688 (2013.01); H01L 23/66 (2013.01); H01L 2223/6683 (2013.01); H05K 1/0313 (2013.01); H05K 1/16 (2013.01); H05K 3/32 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

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