The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Mar. 26, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Renquan Gu, Beijing, CN;

Qi Yao, Beijing, CN;

Jaiil Ryu, Beijing, CN;

Zhiwei Liang, Beijing, CN;

Yingwei Liu, Beijing, CN;

Wusheng Li, Beijing, CN;

Muxin Di, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); H01L 27/3258 (2013.01); H01L 2227/323 (2013.01);
Abstract

An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.


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