The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Nov. 20, 2020
Applicant:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Inventors:

Reginald D. Bean, Center Point, IA (US);

Bret W. Simon, West Liberty, IA (US);

Russell C. Tawney, Cedar Rapids, IA (US);

Ross K. Wilcoxon, Cedar Rapids, IA (US);

Assignee:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/13 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/13 (2013.01); H01L 23/367 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01);
Abstract

A semiconductor package system is disclosed. The system includes a first interposer and a first integrated circuit die electrically coupled and thermally coupled to a first side of the first interposer. The system further includes a second integrated circuit die electrically coupled and thermally coupled to a second side of the first interposer. The system further includes a ring carrier electrically coupled and thermally coupled to the first interposer. The ring carrier is configured to transmit an input to the first interposer. In some embodiments, the system further includes at least one thermal spreader thermally coupled to the ring carrier and at least one of the first integrated circuit, the second integrated circuit, or the first interposer.


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