The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Jul. 14, 2020
Applicant:
Hitachi, Ltd., Tokyo, JP;
Inventor:
Shuntaro Machida, Tokyo, JP;
Assignee:
HITACHI, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); H01L 23/00 (2006.01); B06B 1/02 (2006.01); B81B 3/00 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); B06B 1/0292 (2013.01); B81B 3/0072 (2013.01); A61B 8/445 (2013.01); B81B 2201/0271 (2013.01);
Abstract
Provided is a semiconductor chip, including: a semiconductor substrate; a thin film formed on the semiconductor substrate, the thin film having internal stress; and a semiconductor device formed on the semiconductor substrate that has the thin film formed thereon, wherein the semiconductor chip warps due to the internal stress of the thin film.