The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Aug. 27, 2021
Applicant:

U.s. Government As Represented BY the Secretary of the Army, Dover, NJ (US);

Inventors:

Stephen Redington, Wharton, NJ (US);

Christopher Macrae, Wharton, NJ (US);

Matthew Sargent, Branchville, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/60 (2021.08); H01L 24/14 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2021/6024 (2013.01); H01L 2021/60135 (2013.01);
Abstract

A circuit assembly with an electrical connection between two individual Printed Circuit Boards (PCBs) or Circuit Card Assemblies (CCAs) that are vertically stacked with a connection formed entirely of solder and with a gap in between surfaces that components may occupy. Coalescing solder paste merges between the surfaces when it is in a liquid state to form a solder bridge. The resultant assembly can be encapsulated to form a solid monolithic electronic assembly to improve robustness and allow the assembly to better withstand compressive forces.


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