The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Oct. 04, 2016
Applicant:

Nanohenry, Inc., San Diego, CA (US);

Inventor:

Osman Ersed Akcasu, Morgan Hill, CA (US);

Assignee:

nanoHenry, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01G 4/005 (2006.01); H01L 49/02 (2006.01); H01G 4/33 (2006.01); H01G 4/236 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 41/041 (2013.01); H01G 4/005 (2013.01); H01G 4/232 (2013.01); H01G 4/236 (2013.01); H01G 4/33 (2013.01); H01L 28/10 (2013.01); H01L 28/60 (2013.01); H01G 4/1245 (2013.01);
Abstract

New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.


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