The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Mar. 29, 2021
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Keisuke Sugita, Tokyo, JP;

Masahiro Abe, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/18 (2006.01); H01B 19/00 (2006.01); H01B 7/00 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0045 (2013.01); H01B 7/18 (2013.01); H01B 19/00 (2013.01); H01B 3/302 (2013.01); H01B 3/305 (2013.01);
Abstract

A wire harness includes a multi-core cable including a group of cables composed of a plurality of cables, and a sheath provided around the group of cables, and a resin mold covering the group of cables at a cable branching portion where the group of cables exposed from an end of the sheath of the multi-core cable are branched. An outermost layer of each cable constituting the group of cables includes polyolefin or thermoplastic polyurethane. When the sheath includes polyolefins, the group of cables includes at least one cable including an outermost layer including thermoplastic polyurethane. When the sheath includes thermoplastic polyurethane, the group of cables includes at least one cable having an outermost layer comprising polyolefin. The resin mold includes a resin composition of a polymer alloy of a first polymer including at least one of polyamide polymer, polyester polymer, and thermoplastic polyurethane and a second polymer including polyolefin.


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