The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

May. 09, 2019
Applicant:

Conocophillips Company, Houston, TX (US);

Inventors:

Nicolas Patrick Roussel, Houston, TX (US);

Yueming Liang, Houston, TX (US);

Zijun Fang, Houston, TX (US);

Assignee:

CONOCOPHILLIPS COMPANY, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 1/28 (2006.01); G01V 1/50 (2006.01); G06F 30/20 (2020.01); E21B 43/26 (2006.01); E21B 47/06 (2012.01); E21B 49/00 (2006.01);
U.S. Cl.
CPC ...
G01V 1/282 (2013.01); E21B 43/26 (2013.01); E21B 47/06 (2013.01); E21B 49/003 (2013.01); E21B 49/008 (2013.01); G01V 1/50 (2013.01); G06F 30/20 (2020.01); G01V 2210/6242 (2013.01); G01V 2210/6244 (2013.01); G01V 2210/6248 (2013.01);
Abstract

Method for characterizing subterranean formation is described. One method involves simulating a poroelastic pressure response of known fracture geometry utilizing a geomechanical model to generate a simulated poroelastic pressure response. Compiling a database of simulated poroelastic pressure responses. Measuring a poroelastic pressure response of the subterranean formation during a hydraulic fracturing operation to generate a measured poroelastic pressure response. Identifying a closest simulated poroelastic pressure response in the library of simulated poroelastic pressure response. Estimating a geometrical parameter of a fracture or fractures in the subterranean formation based on the closest simulated poroelastic pressure response.


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