The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Dec. 12, 2019
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Seow Yuen Yee, Mountain View, CA (US);

Franz Laermer, Weil der Stadt, DE;

Christian Peters, Mountain View, CA (US);

Oliver Peters, Bad Liebenzell, DE;

Thomas Rocznik, Mountain View, CA (US);

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/22 (2006.01); G01N 33/00 (2006.01); G01N 27/02 (2006.01);
U.S. Cl.
CPC ...
G01N 27/22 (2013.01); G01N 27/02 (2013.01); G01N 33/0098 (2013.01);
Abstract

A mold sensor is configured with an enclosed chamber in which a nutrient-treated substrate is positioned. The mold sensor includes a sensor for measuring electrical properties of the substrate. The substrate includes conductive elements to interface with a controller to measure the electrical properties. The controller operates the sensor and is programmed to detect a presence of mold growing in the chamber based on the electrical properties.


Find Patent Forward Citations

Yee, Seow. (2022). Mold detecting device using sensor to measure electrical properties (U.S. Patent No. 11499934). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11499934

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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