The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Nov. 02, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Hajime Sasaki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01M 3/24 (2006.01); H01L 23/02 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01M 3/24 (2013.01); H01L 22/34 (2013.01); H01L 23/02 (2013.01);
Abstract
A test method for a semiconductor device having a package with airtight space, which is formed between a substrate wafer on which an element is formed and a cap wafer which is provided being opposite to the substrate wafer, comprises an applying water process in which the semiconductor device is exposed to high moisture atmosphere and cooled and a leak discrimination process in which power is supplied to the element which is formed on the substrate wafer and leak of the package is discriminated by detecting a sound wave which is generated by the semiconductor device.