The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Jul. 22, 2019
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Calin Miclaus, Fremont, CA (US);

Chung-Hsien Lin, Hsinchu, TW;

Jye Ren, Taipei, TW;

Tim Piessens, Gaston, BE;

Pei-Wen Yen, Hsinchu, TW;

Manish Sharma-Kulamarva, Chandler, AZ (US);

Assignee:

InvenSense, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 25/56 (2006.01); G01N 27/12 (2006.01); G01L 19/06 (2006.01); G01L 19/00 (2006.01); G01L 9/00 (2006.01); G01N 27/22 (2006.01); G01N 27/04 (2006.01);
U.S. Cl.
CPC ...
G01L 19/0654 (2013.01); G01L 9/0041 (2013.01); G01L 19/0092 (2013.01); G01N 25/56 (2013.01); G01N 27/048 (2013.01); G01N 27/223 (2013.01);
Abstract

A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.


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