The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Apr. 08, 2021
Applicant:

Aisin Fukui Corporation, Echizen, JP;

Inventors:

Akihiro Seki, Echizen, JP;

Nobuyuki Naito, Echizen, JP;

Yoichi Jinza, Echizen, JP;

Hiroshi Fukuchi, Tokyo, JP;

Kazuo Hikida, Tokyo, JP;

Ken Takata, Tokyo, JP;

Naruhiko Nomura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C21D 1/673 (2006.01); B21D 37/16 (2006.01); C21D 1/18 (2006.01); C21D 9/00 (2006.01); B21D 24/00 (2006.01); B21D 22/20 (2006.01); B21D 22/02 (2006.01);
U.S. Cl.
CPC ...
C21D 1/673 (2013.01); B21D 22/022 (2013.01); B21D 22/20 (2013.01); B21D 24/00 (2013.01); B21D 37/16 (2013.01); C21D 1/18 (2013.01); C21D 9/00 (2013.01);
Abstract

A cooling method for a workpiece includes placing entirety of the workpiece in an inner space of a recess provided on a molding surface of a lower mold, pressing or restraining the workpiece by a mold including the lower mold and an upper mold in which a protrusion corresponding to the recess of the lower mold is provided on a molding surface, supplying a liquid coolant to the inner space of the recess through a coolant supply passage provided in at least one of the lower mold and the upper mold by a pump, and discharging air in the inner space of the recess upward through an air escape passage, and cooling the workpiece by immersing the entirety of the workpiece, which has been heated, in the liquid coolant that fills the recess.


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