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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11499080 B1

PDFFull Text
Date of Patent:
Nov. 15, 2022

Filed:

May. 08, 2018

Thermal interface material, and preparation and application thereof

Applicant:

Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, Zhejiang, CN;

Inventors:

Wen Dai, Zhejiang, CN;

Zhengde Lin, Zhejiang, CN;

Nan Jiang, Zhejiang, CN;

Jinhong Yu, Zhejiang, CN;

Dan Dai, Zhejiang, CN;

Hao Hou, Zhejiang, CN;

Assignee:

NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING CHINESE ACADEMY OF SCIENCES, Zhejiang, CN;

Attorney:

Panitch Schwarze Belisario & Nadel LLP

Primary Examiner:

Hui H Chin

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C01B 32/194 (2017.01); C01B 21/064 (2006.01); C08K 9/02 (2006.01); C08L 79/08 (2006.01); H01L 23/373 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C01B 21/0648 (2013.01); C01B 32/194 (2017.08); C08K 9/02 (2013.01); C08L 79/08 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); B82Y 30/00 (2013.01); C01B 2204/02 (2013.01); C01B 2204/24 (2013.01); C08K 2201/001 (2013.01); C08K 2201/011 (2013.01);
Abstract

This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material. The thermal interface material combines excellent thermal conductivity and compressibility; the preparation method has the characteristics of simple process, low costs, safety and environmental protection, and accordingly, the thermal interface material can effectively resolve the heat dissipation problem of electronic products.

Find Patent Forward Citations

Dai, Wen. (2022). Thermal interface material, and preparation and application thereof (U.S. Patent No. 11499080). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11499080

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