The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Jul. 05, 2018
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Katsunori Takahashi, Shiga, JP;

Juichi Fukatani, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 29/14 (2006.01); C08J 9/10 (2006.01); C08K 5/00 (2006.01); C08K 5/11 (2006.01);
U.S. Cl.
CPC ...
C08L 29/14 (2013.01); C08J 9/103 (2013.01); C08K 5/0016 (2013.01); C08K 5/0025 (2013.01); C08K 5/11 (2013.01); C08J 2201/026 (2013.01); C08J 2205/06 (2013.01); C08J 2329/14 (2013.01); C08L 2203/14 (2013.01);
Abstract

The present invention aims to provide a resin foam excellent in shock absorption properties and damping properties and less likely to cause sheet misalignment. Provided is a resin foam having a multitude of cells, the resin foam containing: a polyvinyl acetal; and a plasticizer, the resin foam having a loss tangent tan δ with a peak of 0.5 or higher in the range of 0° C. to 50° C. as determined by dynamic viscoelasticity measurement at a measurement frequency of 1 Hz, and the resin foam having a 23° C. compression set of 85% or lower.


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