The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Apr. 04, 2019
Applicant:

Corning Incorporated, Corning, NY (US);

Inventor:

William Joseph Bouton, Big Flats, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 41/45 (2006.01); B05D 1/02 (2006.01); B05D 7/04 (2006.01); B32B 7/06 (2019.01); B33Y 10/00 (2015.01); B05D 3/12 (2006.01); B32B 18/00 (2006.01); C04B 35/622 (2006.01); B05D 3/02 (2006.01); B05B 9/00 (2006.01); B05B 13/02 (2006.01); B05D 1/28 (2006.01);
U.S. Cl.
CPC ...
C04B 41/4523 (2013.01); B05D 1/02 (2013.01); B05D 3/12 (2013.01); B05D 7/04 (2013.01); B32B 7/06 (2013.01); B32B 18/00 (2013.01); B33Y 10/00 (2014.12); C04B 35/62218 (2013.01); C04B 35/62222 (2013.01); B05B 9/002 (2013.01); B05B 13/0221 (2013.01); B05D 1/286 (2013.01); B05D 3/0272 (2013.01); B05D 2201/02 (2013.01); B05D 2202/00 (2013.01); B05D 2203/22 (2013.01); B05D 2252/02 (2013.01);
Abstract

A process for manufacturing continuous ceramic tape includes steps of heating a ceramic feedstock to a molten state and spraying molten droplets of the feedstock onto a deposition surface. The method further includes forming a ceramic coating on the deposition surface by accumulating the droplets, which solidify and are directly bonded to one another. The deposition surface is non-stick with respect to the ceramic coating such that the coating may be peeled off of the deposition surface as a continuous ceramic tape, without fracture. Additionally, in embodiments, the deposition surface is removed by running the deposition over a bending edge, chemically stripping or dissolving the deposition surface, or burning the deposition surface.


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