The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Feb. 26, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kazuki Noma, Tokyo, JP;
Hiromichi Akiyama, Tokyo, JP;
Toshio Kozasa, Tokyo, JP;
Masayuki Kanemasu, Tokyo, JP;
Shunichi Morishima, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
The present invention addresses the problem of providing a method for molding, using a honeycomb core, a composite material structure that is high-quality, low cost, and leaves less voids. The present disclosure addresses the problem of providing a method for molding, using a honeycomb core, a composite material structure with which it is possible to reduce dimples in a composite material skin at low cost. According to a method for molding a composite material structure of the present disclosure, an uncured composite material honeycomb sandwich panel in which prepreg is laminated on upper and lower surfaces of a honeycomb core via an adhesive is covered with a vacuum bag and placed in an autoclave. After that, the vacuum bag is evacuated and, while the evacuation is being continued, is heated and pressurized by the autoclave to cure a matrix resin of the prepreg and achieve adhesion to the honeycomb core.