The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Mar. 08, 2018
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kodai Shimono, Tokyo, JP;
Hiroshi Tokutomi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A method for molding a composite material obtained by laying up a fiber-reinforced base material includes: disposing a lay-up in which the fiber-reinforced base material is laid up, on a molding surface of a molding jig; covering the lay-up with a film to hermetically seal the lay-up; supplying resin toward the lay-up from a resin supplying unit; sucking atmosphere in the film from a degassing waterproof unit while blocking the resin in the film from passing to impregnate the lay-up with the resin; and discharging the resin in the film from a resin discharging unit after the lay-up is impregnated with the resin. The resin supplying unit is provided on the film side. The degassing waterproof unit is provided on the molding surface side and along one direction in a plane perpendicular to a laying-up direction of the lay-up. The resin discharging unit is provided at the film side.