The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Jan. 08, 2020
Applicant:

The Boeing Company, Chicago, IL (US);

Inventor:

Nishant Sinha, Bangalore, IN;

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 64/314 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 40/10 (2020.01); D06M 15/333 (2006.01); B29K 31/00 (2006.01); B29K 79/00 (2006.01); D06M 101/30 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/314 (2017.08); D06M 15/333 (2013.01); B29K 2031/04 (2013.01); B29K 2079/085 (2013.01); B29K 2995/0037 (2013.01); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/00 (2014.12); D06M 2101/30 (2013.01);
Abstract

A coated filament for use in additive manufacturing includes a base polymer layer formed of a base polymer material and a coating polymer layer formed of a coating polymer material. At least the coating polymer material is susceptible to dielectric heating in response to electromagnetic radiation, thereby promoting fusion between adjacent beads of coated filament that are deposited during the additive manufacturing process. Specifically, when electromagnetic radiation is applied to an interface area between two adjacent beads of the coated filament, the polymer coating layer melts to diffuse across the interface area, thereby preventing formation of voids. The base polymer material and the coating polymer material of the coated filament also may have similar melting points and compatible solubility parameters to further promote fusion between beads.


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