The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
May. 13, 2020
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Ryo Nawata, Utsunomiya, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 33/42 (2006.01); B29C 35/08 (2006.01); H01L 21/027 (2006.01); H01L 21/266 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 33/424 (2013.01); B29C 35/0805 (2013.01); H01L 21/0273 (2013.01); H01L 21/266 (2013.01); H01L 21/3086 (2013.01);
Abstract
An imprint method includes bringing a mold and an uncured imprint material supplied onto a substrate into contact with each other, enhancing viscoelasticity of the imprint material, making position adjustment of the mold and the substrate, and curing the imprint material. The imprint material is supplied onto a shot region of the substrate, and time between bringing the mold brought into contact with the imprint material and starting enhancing viscoelasticity is shorter when the shot region includes an outer periphery of the substrate than when the shot region does not include the outer periphery of the substrate.