The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Dec. 04, 2018
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Seung Whan Oh, Daejeon, KR;
Won Sang Kwon, Daejeon, KR;
Yong Seok Jung, Daejeon, KR;
Jung Eun Kim, Daejeon, KR;
Sang Jin Shin, Daejeon, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/14 (2006.01); B29C 41/00 (2006.01); C08J 5/02 (2006.01); C08J 7/18 (2006.01); C08L 9/04 (2006.01); C08L 13/02 (2006.01);
U.S. Cl.
CPC ...
B29C 41/14 (2013.01); B29C 41/003 (2013.01); C08J 5/02 (2013.01); C08J 7/18 (2013.01); C08L 9/04 (2013.01); C08L 13/02 (2013.01); C08J 2309/04 (2013.01); C08J 2313/02 (2013.01); C08J 2449/00 (2013.01);
Abstract
Provided is a dip-molded article, and more particularly, provided are a dip-molded article including: a layer derived from a latex composition for dip-molding; and a layer derived from a polymer including a repeating unit derived from a diacetylene-based compound, a latex composition for dip-molding, and a preparation method thereof.