The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Mar. 15, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Mohammed S Shaarawi, Corvallis, OR (US);

James McKinnell, Corvallis, OR (US);

Vladek Kasperchik, Corvallis, OR (US);

David A Champion, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/00 (2021.01); B22F 3/10 (2006.01); B22F 5/00 (2006.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); B29C 64/165 (2017.01); B33Y 70/10 (2020.01); B22F 10/14 (2021.01); B22F 10/85 (2021.01); B22F 10/64 (2021.01); B33Y 80/00 (2015.01); B22F 10/68 (2021.01); B22F 10/32 (2021.01); B22F 10/47 (2021.01); B33Y 40/00 (2020.01); C09D 11/033 (2014.01); C09D 11/38 (2014.01); B22F 1/05 (2022.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 40/20 (2020.01); B29K 505/00 (2006.01);
U.S. Cl.
CPC ...
B22F 10/00 (2021.01); B22F 1/05 (2022.01); B22F 3/1021 (2013.01); B22F 5/003 (2013.01); B22F 10/14 (2021.01); B22F 10/32 (2021.01); B22F 10/47 (2021.01); B22F 10/64 (2021.01); B22F 10/68 (2021.01); B22F 10/85 (2021.01); B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); C09D 11/033 (2013.01); C09D 11/38 (2013.01); B22F 2201/013 (2013.01); B22F 2302/10 (2013.01); B22F 2302/45 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29K 2505/00 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12);
Abstract

In an example of a method for three-dimensional (3D) printing, build material layers are patterned to form an intermediate structure. During patterning, a binding agent is selectively applied to define a patterned intermediate part. Also during patterning, i) the binding agent and a separate agent including a gas precursor are, or ii) a combined agent including a binder and the gas precursor is, selectively applied to define a build material support structure adjacent to at least a portion of the patterned intermediate part. The intermediate structure is heated to a temperature that activates the gas precursor to create gas pockets in the build material support structure.


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