The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Jun. 27, 2019
Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Wei Zhao, Beijing, CN;
Chunlei Wang, Beijing, CN;
Kun Jiang, Beijing, CN;
Na Li, Beijing, CN;
Xuechao Song, Beijing, CN;
Lin Han, Beijing, CN;
Lanjun Guo, Beijing, CN;
Shaowu Ma, Beijing, CN;
Kangdi Zhou, Beijing, CN;
Jinshuai Duan, Beijing, CN;
Xianping Luo, Beijing, CN;
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Beijing, CN;
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., Beijing, CN;
Abstract
A digital microfluidic chip, a method for driving the same, and a digital microfluidic device are provided. The digital microfluidic chip includes a state transition layer configured to bear a droplet, and a light driving layer configured to provide light for controlling a lyophobicity-lyophobicity transition of the state transition layer to drive the droplet to move. The light driving layer includes light emitting units arranged in an array and provides light. The state transition layer realizes a lyophobicity-lyophobicity transition. The light driving layer controls the lyophobicity-lyophobicity transition by providing light to drive the droplet to move. An existing digital microfluidic chip has a complex structure and a high fabricating cost, while the digital microfluidic chip of the present disclosure has a simple structure, a simple fabricating process and a low fabricating cost, and can realize miniaturization and integration to a maximum extent.