The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Oct. 03, 2019
Aros Electronics Ab, Mölndal, SE;
Jerker Hellström, Nol, SE;
AROS ELECTRONICS AB, Mölndal, SE;
Abstract
An assembly () for dissipating heat generated by a heat generating electrical component () which is surface mounted on a circuit board () in a surface mounting process. The assembly comprises a heat buffer () made of a thermally and electrically conducing material, and being surface mounted on the circuit board () so as to be soldered to a thermal flag () of the heat generating electrical component (). The assembly further comprises a heat sink () in thermal contact with the heat buffer, and a galvanic separation () between the heat buffer and heat sink. The heat capacitance of the heat buffer can absorb short term increases in heat dissipation from the electrical component, before the heat is further dissipated to the galvanically separated heat sink. This may drastically improve performance of the surface mounted component.