The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Aug. 14, 2020
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventor:

Tsuyoshi So, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0203 (2013.01); H05K 1/115 (2013.01); H05K 3/303 (2013.01); H05K 7/1418 (2013.01); H05K 2201/10598 (2013.01);
Abstract

An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.


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