The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Oct. 10, 2019
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/02 (2006.01); H01L 41/338 (2013.01); H03H 9/10 (2006.01); H03H 9/205 (2006.01); H03H 9/56 (2006.01); H03H 9/05 (2006.01); H04B 1/3827 (2015.01); H03F 3/20 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02133 (2013.01); H01L 41/338 (2013.01); H03H 3/02 (2013.01); H03H 9/02102 (2013.01); H03H 9/02125 (2013.01); H03H 9/0514 (2013.01); H03H 9/105 (2013.01); H03H 9/205 (2013.01); H03H 9/566 (2013.01); H03F 3/20 (2013.01); H03F 2200/451 (2013.01); H04B 1/3827 (2013.01);
Abstract
Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components