The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Jun. 29, 2018
Applicant:

Enplas Corporation, Saitama, JP;

Inventor:

Keiichi Narumi, Santa Clara, CA (US);

Assignee:

Enplas Corporation, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); H01R 12/57 (2011.01); H01R 13/193 (2006.01); H01R 13/6473 (2011.01); H01R 13/6594 (2011.01); H01R 12/58 (2011.01); H01R 12/55 (2011.01); H01R 24/40 (2011.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 12/718 (2013.01); G01R 1/06722 (2013.01); G01R 1/07314 (2013.01); H01R 12/57 (2013.01); H01R 12/58 (2013.01); H01R 12/714 (2013.01); H01R 13/193 (2013.01); H01R 13/6473 (2013.01); H01R 13/6594 (2013.01); H01R 12/55 (2013.01); H01R 12/71 (2013.01); H01R 12/712 (2013.01); H01R 12/716 (2013.01); H01R 12/73 (2013.01); H01R 24/40 (2013.01);
Abstract

An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.


Find Patent Forward Citations

Quick Actions:

Narumi, Keiichi. (2022). Electric connection socket connecting a circuit board and an integrated circuit package (U.S. Patent No. 11495901). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11495901

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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