The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Feb. 19, 2019
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroto Ohwada, Annaka, JP;

Minoru Igarashi, Annaka, JP;

Tsutomu Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); B01J 20/26 (2006.01); H01L 51/56 (2006.01); B01J 20/28 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5259 (2013.01); B01J 20/26 (2013.01); B01J 20/262 (2013.01); B01J 20/28033 (2013.01); H01L 51/5246 (2013.01); H01L 51/56 (2013.01); H01L 2251/558 (2013.01);
Abstract

A transparent desiccant for organic EL and methods for using the transparent desiccant are described, which is a cured product of an organopolysiloxane composition that contains (A) an alkenyl-group-containing organopolysiloxane including a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) chemical formula (I):HRSiO  (I)(where R is a C1-10 monovalent hydrocarbon group, a is 0.001-1.0, and b is 0.7-2.1), and (C) a hydrosilylation catalyst. The number of mol Y of silicon-atom-bonded hydrogen atoms (mol) in component (B) satisfies the formula 0.002 (mol)≤(Y-X)≤0.8 (mol) relative to the number of mol X of silicon-atom-bonded alkenyl groups (mol) in component (A). The transparent desiccant for an organic EL is highly transparent, capable of top emission, has low shrinkage growth, suppresses loss of an element light-emitting portion, suppresses the short-circuit phenomenon, and has exceptional defoaming properties in the material curing process.


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