The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Aug. 28, 2018
Applicant:
Osram Oled Gmbh, Regensburg, DE;
Inventor:
Michael Mueller, Garching, DE;
Assignee:
OSRAM OLED GMBH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/09 (2006.01); H01L 31/0203 (2014.01); H01L 31/173 (2006.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 31/09 (2013.01); H01L 31/0203 (2013.01); H01L 31/02327 (2013.01); H01L 31/173 (2013.01); H01L 31/18 (2013.01); H01L 33/005 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01);
Abstract
A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing an optoelectronic semiconductor chip with a radiation passage surface on a connection carrier, applying a deformable spacer to the radiation passage surface of the semiconductor chip, inserting the connection carrier with the semiconductor chip into a cavity of a tool, deforming, by the tool, the deformable spacer and encapsulating the semiconductor chip with a casting compound.