The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Mar. 18, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyoungsoo Kim, Hwaseong-si, KR;
Sunwon Kang, Seongnam-si, KR;
Seungduk Baek, Hwaseong-si, KR;
Ho Geon Song, Suwon-si, KR;
Kyung Suk Oh, Seongnam-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a first die including a signal region and a peripheral region bordering the signal region and having first vias in the peripheral region, a second die stacked on the first die and having second vias at positions corresponding to the first vias in the peripheral region, and first connection terminals between the first die and the second die that are configured to connect the second vias to the first vias, respectively. The peripheral region includes first regions and second regions configured to transmit different signals, which are alternately arranged in a first direction. The first vias are arranged in at least two rows along a second direction intersecting the first direction in each of the first and second regions.