The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Jul. 15, 2020
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Mark Griswold, Gilbert, AZ (US);
Michael J. Seddon, Gilbert, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/522 (2006.01); H01L 23/34 (2006.01); H01L 21/786 (2006.01); H01L 21/02 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5222 (2013.01); H01L 21/0226 (2013.01); H01L 21/786 (2013.01); H01L 23/12 (2013.01); H01L 23/34 (2013.01);
Abstract
Implementations of a silicon-on-insulator (SOI) die may include a silicon layer including a first side and a second side, and an insulative layer coupled directly to the second side of the silicon layer. The insulative layer may not be coupled to any other silicon layer.