The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Feb. 15, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Hajime Amano, Tokyo, JP;

Akihiro Harada, Tokyo, JP;

Kenji Horino, Tokyo, JP;

Hiroyuki Matsumoto, Tokyo, JP;

Kazuhiro Yoshidome, Tokyo, JP;

Akito Hasegawa, Tokyo, JP;

Kensuke Ara, Tokyo, JP;

Masakazu Hosono, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/153 (2006.01); C22C 45/00 (2006.01);
U.S. Cl.
CPC ...
H01F 1/15333 (2013.01); C22C 45/008 (2013.01); C22C 2200/02 (2013.01); C22C 2202/02 (2013.01);
Abstract

Provided is a soft magnetic alloy which has high saturation flux density and low coercivity and is represented by the compositional formula (FeX1X2)MPSiCuX3B, wherein X1 is at least one element selected from the group consisting of Co and Ni, X2 is at least one element selected from the group consisting of Ti, V, Mn, Ag, Zn, Al, Sn, As, Sb, Bi, and rare earth elements, X3 is at least one element selected from the group consisting of C and Ge, and M is at least one element selected from the group consisting of Zr, Nb, Hf, Ta, Mo, and W, and wherein 0.030≤a≤0.120, 0.010≤b≤0.150, 0≤c≤0.050, 0≤d≤0.020, 0≤e≤0.100, 0≤f≤0.030, α≥0, β≥0, and 0≤α+β≤0.55.


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