The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Jan. 14, 2021
Applicant:

Tpk Advanced Solutions Inc., Fujian, CN;

Inventors:

Xian Bin Xu, Xiamen, CN;

Ming Qiang Fu, Liancheng County, CN;

Shi Yuan Lian, Fu'an, CN;

Yong Hui Huang, Longhai, CN;

Xiong Min Zhang, Zhangpu County, CN;

Chen Hsin Chang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); H05K 1/02 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B32B 7/12 (2013.01); B32B 27/281 (2013.01); B32B 27/36 (2013.01); H05K 1/028 (2013.01); H05K 1/0274 (2013.01); B32B 2250/05 (2013.01); B32B 2307/412 (2013.01); B32B 2307/42 (2013.01); B32B 2307/732 (2013.01); B32B 2457/208 (2013.01); H05K 2201/10121 (2013.01);
Abstract

An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with a conductive glue. A gap is formed between flexible circuit board and polarizer. The first transparent glue layer is disposed on the second side of substrate. The first colloid is configured to bond at least two of substrate, polarizer, or flexible printed circuit board. The second colloid is configured to bond at least two of the substrate, the flexible printed circuit board, or the first transparent glue layer. The first colloid is not in contact with the second colloid.


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