The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

May. 19, 2020
Applicant:

Mistras Group, Inc., Princeton Junction, NJ (US);

Inventors:

Mostafa Hasanian, Princeton Junction, NJ (US);

Hossain Saboonchi, Princeton Junction, NJ (US);

Miguel A. Gonzalez-Nunez, Princeton Junction, NJ (US);

Valery Godinez-Azcuaga, Princeton Junction, NJ (US);

Assignee:

Mistras Group, Inc., Princeton, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); G01N 29/14 (2006.01); G01N 29/44 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G01N 29/14 (2013.01); G01N 29/4472 (2013.01); G01N 2291/0289 (2013.01); G05B 2219/32368 (2013.01); G05B 2219/49023 (2013.01);
Abstract

Embodiments provide systems and methods for utilizing acoustic sensors to detect defects via online or in situ monitoring of additive manufacturing (AM) processes. Sensors may capture acoustic waves associated with AM manufacturing operations. The acoustic emissions in combination with other sensing data, such as cameras or thermometers, may be used to characterize the state of the AM process, such as to detect a defect has occurred or confirm a defect has not occurred. When defects are detected, the AM process may be stopped to prevent further processing of a defective part. When defects are predicted as likely to occur, operational parameters of the AM device or process may be adjusted to mitigate the occurrence of a defect. The techniques disclosed herein enable detection of defects that occur underneath the surface of the part being manufactured, as well as correct issues with the AM device or process before a defect occurs.


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