The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Jul. 14, 2020
Applicant:
Tdk Taiwan Corp., Taoyuan, TW;
Inventors:
Chao-Chang Hu, Taoyuan, TW;
Yi-Liang Chan, Taoyuan, TW;
Assignee:
TDK TAIWAN CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 7/04 (2021.01); G02B 7/09 (2021.01); G03B 13/36 (2021.01); H02K 41/035 (2006.01); G02B 7/08 (2021.01); G02B 27/64 (2006.01); G03B 5/02 (2021.01); G03B 3/10 (2021.01);
U.S. Cl.
CPC ...
G02B 7/09 (2013.01); G02B 7/08 (2013.01); G02B 27/646 (2013.01); G03B 3/10 (2013.01); G03B 5/02 (2013.01); G03B 13/36 (2013.01); H02K 41/0356 (2013.01); G03B 2205/0015 (2013.01); G03B 2205/0069 (2013.01);
Abstract
A circuit module is provided and includes a metal substrate, an insulating layer, and a circuit element. The metal substrate includes a main body, a bent portion, and an opening. The opening is formed between the main body and the bent portion, and the bent portion is bent relative to the main body. The insulating layer is disposed on the metal substrate. The circuit element is disposed on the insulating layer and is extended across the opening.